Bin Liu, Ph.D.
Lecturer Bin Liu, Ph.D.
Title "Enhancing Indoor-to-Outdoor Communication with Transparent Amplifying Intelligent Surface”
Date Tuesday, 21 May, 2024; 03:45 pm
Location S2|20 (Pankratiusstraße 2), Room 09/10
Abstract
In this talk, we will present a novel transparent amplifying intelligent surface (TAIS) architecture for uplink enhancement in indoor-to-outdoor mmWave communications. The TAIS is an amplifier-based transmissive intelligent surface that can refract and amplify the incident signal, instead of only refracting it with adjustable phase shift by most passive reconfigurable intelligent surfaces (RIS). With advanced indium tin oxide film and printing technology, TAIS can be fabricated on the windows without any visual effects. This paper primarily focuses on exploiting the TAIS-based architecture to boost the uplink spectral efficiency (SE) in indoor-to-outdoor mmWave communications. By jointly optimizing the TAIS's phase shift matrix and transmit power of the user equipment, the uplink SE can be maximized by exploiting the nonlinearity in the TAIS's amplification process. Moreover, a power optimization algorithm was established based on the DC programming, with significantly low complexity. Extensive simulations demonstrated that our approach can boost the uplink capacity with efficient energy saving of indoor UEs.
Bio
Bin Liu received a Ph.D. degree in electrical engineering Ph.D. degree in electrical engineering at KU Leuven, Belgium, in 2024. He was a visiting scholar at Delft University of Technology, the Netherlands, from March to October 2022. His research interests encompass signal processing in massive MIMO, reconfigurable intelligent surfaces, mmWave communications, and intelligent transportation system. He was awarded the Best Paper at the IEEE ICC 2023.